Seminar: Jamshid Sorooshian

May 9, 2025

Intel Technology Roadmap and Challenges

Jamshid Sorooshian, Intel Corporation, Rio Rancho, NM

3:00 pm, UNM Centennial Engineering Center, Room 1026
Online Guests: Contact Prof. Osiński <osinski@chtm.unm.edu> for a Zoom link

Abstract: The 3D Inter-Connect (IC) technology roadmap is strong and vital to meet new market demands.

The challenges with integrated supply chains, evolving customer demand, and new engineeringbased problems have driven a need for more focus on building robustness in the 3D IC lines for both suppliers and customers alike.

The demand for greater computing requires larger packaged components. This will drive increased probability of failure, as well as concerns around power consumption and cooling requirements.

This talk will provide a high level overview on the fundamentals of 3D packaging and its challenges in the world of AI product lines.

Bio: Dr. Jamshid Sorooshian is the New Mexico Site Manager for Program and Technology focused on specialty processes specific to the New Mexico site and the broader disaggregate manufacturing organization. He received his PhD from the University of Arizona from the Department of Chemical Engineering with a focus on semiconductor planarization processes. He has spent his professional career at Intel Corporation spanning roles in Process Engineering, Yield and Integration, Technology and Development, and Technology Transfer management. Dr. Sorooshian currently manages all aspects of cost, technology risk assessment, and technology transfer for the New Mexico site.